Ceramic Bond Dry Floor Polishing Pad
Diamond Ceramic bond Dry floor polishing pad can effectively remove marks left by metal grinding tools, which is aggressive with long life. It is designed to transition from a metal bond diamond grinding process to a resin polishing process. Remove metal bond scratches quicker and will not get too heat during the polishing process, therefore maintains a cooler operational temperature that ultimately increases service life. Ceramic diamond floor polishing pads are usually used for coarse grinding with grits 30, 50,100,200,400.
Diameter: 3”/80mm, thickness: 8mm
Grit: 30, 50, 100, 200, 400
Ceramic bond with velcro backing
Application of Ceramic Bond Dry Floor Polishing Pad: