Diamond Ceramic bond Dry floor polishing pad can effectively remove marks left by metal grinding tools, which is aggressive with long life. It is designed to transition from a metal bond diamond grinding process to a resin polishing process. Remove metal bond scratches quicker and will not get too heat during the polishing process, therefore maintains a cooler operational temperature that ultimately increases service life. Ceramic diamond floor polishing pads are usually used for coarse grinding with grits 30, 50,100,200,400.
Features:
Diameter: 3”/80mm, thickness: 8mm
Grit: 30, 50, 100, 200, 400
Ceramic bond with velcro backing
Application of Ceramic Bond Dry Floor Polishing Pad:
Used for concrete and terrazzo on floor polishing machine
Dry use
Specification:
Item No.
Diameter
Thickness
Grit
Work Type
NZCF-03
3″/80mm
8mm
30,50,100,200,400
Dry Use
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